Microsemi offers full design, fabrication, and test capabilities for simple to complex custom Multi-Chip Packages (MCPs) , Commercial-Off-The-Shelf (COTS) memory, processors and combination MCPs for demanding defense applications.
Memory products include: DDR3 SDRAM, DDR2 SDRAM, DDR SDRAM, SDRAM, SSRAM, SRAM, Flash, and EEPROM, which can be ruggedized and processed as Class H or K compliant.
Microsemi delivers quality through procedures, policies, documentation and continuous improvement:
With more than 40 years of technology excellence and innovation, Microsemi Corp. – Memory and Storage Solutions provides an established, stable source for defense grade microelectronics packaging requirements.
Microsemi’s electronic contract manufacturing and defense electronics services include surface mount assembly and chip on board assembly and test. Microsemi’s manufacturing is an on-shore facility. Products are manufactured and tested in accordance with MIL-PRF-38534 Class H [&] Class K certification.
