High Endurance pSLC NAND (BiCS5) Operating Temperature (-40ºC to +85ºC) MTBF: > 3M hours 153 Ball FBGA(TFBGA) Package Length x Width x Height (11.50 x 13.00 x 1.0 mm) HS400, Field Firmware Update(FFU)
ProductVirtium Industrial eMMC
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Torben Niermeyer
Product Marketing Engineer
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Jens Egbers Application Engineer
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Torben NiermeyerProduct Line Manager
Christian MoserApplication Engineer