The component consists of two high-performance ceramic
PTCs mounted in a lead-frame for (SMD) direct soldering onto
a printed-circuit board (PCB) or substrate. The ceramic PTCs
are soldered to the lead frame by a reflow process, during
which the solder layer is melted to the metallized ceramic
surface using a low residue flux. This structure can hold the
low matched resistance in a loop. The component in
accordance to RoHS.
