Gold Chip NTC Thermistors

TE Connectivity offers a comprehensive range of Gold terminated leadless NTC chip thermistors for today’s hybrid microelectronics needs. With metallization on top and bottom surfaces, attachment to hybrid, IC or PC circuits is accomplished using industry standard die attach and wire bonding techniques. Chips may be soldered or bonded with conductive epoxy to board termination points where space is at a premium. Typical square-chip sizes range from 0.014” to 0.047” depending on the preferred ceramic system and nominal ohmic resistance. Leadless NTC chip thermistors are supplied in “waffle” packs for protection and ease of customer handling.

Technical Data

Key Specifications

0.1K to 1M Ohms Resistance @25ºC
Supplied with ±5% and ±10% tolerance
Higher precision tolerance available
Surface mount capability
Supplied in “gel” or “waffle” packs
Square or rectangular configurations
Temperature range -40ºC to +125ºC

Product Configurations

Product Number	Internal Product Number	Resistance (at 25°C)	Resistance Tolerance (at 25°C)	β-Value(25/85)
20016128-00	20016128-00	10 kΩ	± 2 %	3956 K
GA100K63CG659	10220685-00	100 kΩ	± 2 %	4075 K
GA100K6CG3	GA100K6CG3	100 kΩ	± 5 %	4261 K
GA10K3CG1012	10207486-00	10 kΩ	± 1 %	3956 K
GA10K3CG1211	GA10K3CG1211	10 kΩ	± 1 %	3976 K
GA10K3CG1231	GA10K3CG1231	10 kΩ	± 1 %	3976 K
GA10K3CG1311	GA10K3CG1311	10 kΩ	± 1 %	3956 K
GA10K3CG582	GA10K3CG582	10 kΩ	± 2 %	3976 K
GA10K4CG517	GA10K4CG517	10 kΩ	± 2 %	3694 K
GA17.87K4CG559	11016585-00	17.87 kΩ	± 2 %	3694 K

Applications

WDM (Wavelength Division Multiplexing) for advanced frequency control in communications systems and wireless applications
Thermopile sensors for thermal radiation recognition and infrared sensing
Thermal protection of sensitive circuits Hybrid circuit temperature compensation
Localized temperature sensing
Custom sizes of part numbers listed above are available upon request.