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WG7837-V0

The WG7837‐V0 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth, Bluetooth LE solutions to provide the best WiFi and BT coexistence interoperability and power saving technologies from TI.

Technical Data

Features:

  • Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives and Power
    Management.
  • LGA‐100 pin package
  • Small Form Factor: 13.3 x 13.4 x 2.0 mm.
  • FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas
  • Operating temperature: ‐40°C to 85°C

Datasheet

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WG7837-V0

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